Civic Mail Uppal/Nagole

Uppal residents express concerns over increasing dumping on Chilkanagar road

Uppal residents express concerns over increasing dumping

UPPAL: Residents living along the Chilka Nagar main road in Uppal, Hyderabad have raised serious concerns over the deteriorating cleanliness and sanitation conditions in their area, as the road has reportedly turned into a dumping ground for waste and garbage.

Residents claimed that the road from Beerappagadda to Little Flower College has reverted to a dump yard. Expressing their frustration, local residents have taken to social media platforms to highlight the alarming situation. Tagging the Greater Hyderabad Municipal Corporation (GHMC) in their posts, residents urged municipal authorities to take immediate action to address the issue.

Uppal residents express concerns over increasing dumping on Chilkanagar road

One resident took to ‘X’ (formally Twitter), “It has become the dump yard again. Uppal Chilkanagar road till Berappa Gadda to Little Flower College route has become horrible.”

Despite previous complaints and promises of action, residents claim that there has been no progress in clearing the They are particularly concerned about the lack of no dump boards along the road, which they believe could deter individuals from illegally disposing of waste in the area.

Uppal Chilkanagar road till Berappa Gadda to Little Flower College route has become horrible

“Where are the ‘no dump’ boards? Please do something. Is the area a dump yard?” another resident questioned, highlighting the urgency of the situation.

Deputy EE Uppal, Chandana Chawan responded to the complaint saying, “Dear citizen, boards are displayed at the locations mentioned above location.”

According to residents, the problem exacerbates during the night and early morning hours, as people continue to indiscriminately dump waste along the roadside. Additionally, the weekly roadside vegetable market has been identified as a contributing factor, with vendors leaving behind leftover produce and packaging materials.